Thomas Antretter
Research output
- 2015
- Published
Size effects in residual stress formation during quenching of cylinders made of hot-work tool steel
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2015, In: Advances in Materials Science and Engineering. 7 p., 678056.Research output: Contribution to journal › Article › Research › peer-review
- Published
Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 2015, In: Materials Today: Proceedings. 2, 2, p. 4196-4205 10 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
The rock cutting process of road headers - Overview of laboratory tests and numerical simulation
Pittino, G., Galler, R., Mikl-Resch, M. J., Tichy, R., Ecker, W., Antretter, T., Gimpel, M. & Kargl, H., 2015, Future Development of Rock Mechanics: Proceedings of the ISRM Regional Symposium Eurock 2015 & 64th Geomechanics Colloquium. Schubert, W. & Kluckner, A. (eds.). Salzburg: Eigenverlag, p. 243-248 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2014
- Published
The role of phase interface energy in martensitic transformation: A lattice Monte-Carlo simulation
Yastrebov, V. A., Fischlschweiger, M., Cailletaud, G. & Antretter, T., Mar 2014, In: Mechanics Research Communications. 56, p. 37-41Research output: Contribution to journal › Article › Research › peer-review
- Published
Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Pélisset, T., Karunamurthy, B., Otremba, R. & Antretter, T., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330Research output: Contribution to journal › Article › Research › peer-review
- Published
Determination of cyclic mechanical properties of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method
Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H.-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Festigkeitsskalierung nach Weibull
Pittino, G., Tichy, R., Galler, R., Antretter, T., Ecker, W., Gimpel, M. & Kargl, H., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Method development for the cyclic characterization of thin copper layers for PCB applications
Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60Research output: Contribution to journal › Article › Research › peer-review
- Published
Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks
Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014, Geomechanics from Micro to Macro. p. 1545-1550Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Modelling of phase transformations and residual stress formation in hot-work tool steel components
Schemmel, M., Prevedel, P., Schöngrundner, R., Ecker, W. & Antretter, T., 2014, European Conference of Heat Treatment and 21st IFHTSE Congress. p. 285-292Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Residual Stress Investigations in Thin Film Systems: Experiment and Simulation
Kozic, D., Treml, R., Sartory, B., Schöngrundner, R., Kiener, D., Antretter, T., Gänser, H.-P. & Brunner, R., 2014.Research output: Contribution to conference › Poster › Research › peer-review
- Published
Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Macurova, K., Angerer, P., Antretter, T., Bermejo Moratinos, R., Maia, W., Schöngrundner, R., Krivec, T., Morianz, M. & Brizoux, M., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of the roller straightening process with respect to residual stresses and the curvature trend
Kaiser, R., Hatzenbichler, T., Buchmayr, B. & Antretter, T., 2014, International Conference on Residual Stresses 9 (ICRS 9). p. 456-463Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2013
- Published
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
An Efficient Algorithm for Modeling the Thermo-Mechanical Material Response of Havy Steel Plates during Accelerated Cooling
Eßl, W., Antretter, T. & Parteder, E., 2013, Key engineering materials. Vol. 554-557. p. 749-763 (Key engineering materials).Research output: Chapter in Book/Report/Conference proceeding › Chapter › Research
