Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Materials Center Leoben Forschungs GmbH
- AT and S AG
- Thales
Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014 |
| Pages | 355-360 |
| Number of pages | 6 |
| Publication status | Published - 1 Jan 2014 |
| Event | 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 - San Diego, Austria Duration: 13 Oct 2014 → 16 Oct 2014 |
Conference
| Conference | 47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 |
|---|---|
| Country/Territory | Austria |
| City | San Diego |
| Period | 13/10/14 → 16/10/14 |
