Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

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Translated title of the contribution	Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method
Original language	English
Pages (from-to)	321-330
Journal	Thin solid films
DOIs	https://doi.org/10.1016/j.tsf.2014.06.003
Publication status	Published - 2014