Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

Research output: Chapter in Book/Report/Conference proceedingConference contribution

External Organisational units

  • Materials Center Leoben Forschungs GmbH

Details

Original languageEnglish
Title of host publicationProceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
EditorsG.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
PublisherInstitute of Electrical and Electronics Engineers
ISBN (print)978-1-4799-4791-1
DOIs
Publication statusPublished - 2014
Event15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 - Gent, Belgium
Duration: 7 Apr 20149 Apr 2014

Conference

Conference15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Abbreviated titleEuroSimE 2014
Country/TerritoryBelgium
CityGent
Period7/04/149/04/14