Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

Externe Organisationseinheiten

  • Materials Center Leoben Forschungs GmbH

Details

OriginalspracheEnglisch
TitelProceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
Redakteure/-innenG.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
ISBN (Print)978-1-4799-4791-1
DOIs
StatusVeröffentlicht - 2014
Veranstaltung15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Gent, Belgien
Dauer: 7 Apr. 20149 Apr. 2014

Konferenz

Konferenz15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
KurztitelEuroSimE 2014
Land/GebietBelgien
OrtGent
Zeitraum7/04/149/04/14