Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

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Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. / Kozic, Darjan; Treml, Ruth; Schöngrundner, Ronald et al.
Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Hrsg. / G.Q. Zhang; W.D. Van Driel; P. Rodgers; C. Bailey; O. de Saint Leger. Institute of Electrical and Electronics Engineers, 2014. 6813785.

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Harvard

Kozic, D, Treml, R, Schöngrundner, R, Brunner, R, Kiener, D, Antretter, T & Gänser, H-P 2014, Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. in GQ Zhang, WD Van Driel, P Rodgers, C Bailey & O de Saint Leger (Hrsg.), Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014., 6813785, Institute of Electrical and Electronics Engineers, 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems , Gent, Belgien, 7/04/14. https://doi.org/10.1109/EuroSimE.2014.6813785

APA

Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T., & Gänser, H.-P. (2014). Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. In G. Q. Zhang, W. D. Van Driel, P. Rodgers, C. Bailey, & O. de Saint Leger (Hrsg.), Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 Artikel 6813785 Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE.2014.6813785

Vancouver

Kozic D, Treml R, Schöngrundner R, Brunner R, Kiener D, Antretter T et al. Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. in Zhang GQ, Van Driel WD, Rodgers P, Bailey C, de Saint Leger O, Hrsg., Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Institute of Electrical and Electronics Engineers. 2014. 6813785 doi: 10.1109/EuroSimE.2014.6813785

Author

Kozic, Darjan ; Treml, Ruth ; Schöngrundner, Ronald et al. / Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method. Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Hrsg. / G.Q. Zhang ; W.D. Van Driel ; P. Rodgers ; C. Bailey ; O. de Saint Leger. Institute of Electrical and Electronics Engineers, 2014.

Bibtex - Download

@inproceedings{f1cd1792d99f4f8f8d4c1ddf7224b53f,
title = "Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method",
author = "Darjan Kozic and Ruth Treml and Ronald Sch{\"o}ngrundner and Roland Brunner and Daniel Kiener and Thomas Antretter and Hans-Peter G{\"a}nser",
year = "2014",
doi = "10.1109/EuroSimE.2014.6813785",
language = "English",
isbn = "978-1-4799-4791-1",
editor = "G.Q. Zhang and {Van Driel}, W.D. and P. Rodgers and C. Bailey and {de Saint Leger}, O.",
booktitle = "Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",
note = "15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 ; Conference date: 07-04-2014 Through 09-04-2014",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

AU - Kozic, Darjan

AU - Treml, Ruth

AU - Schöngrundner, Ronald

AU - Brunner, Roland

AU - Kiener, Daniel

AU - Antretter, Thomas

AU - Gänser, Hans-Peter

PY - 2014

Y1 - 2014

UR - http://www.scopus.com/inward/record.url?scp=84901420857&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE.2014.6813785

DO - 10.1109/EuroSimE.2014.6813785

M3 - Conference contribution

AN - SCOPUS:84901420857

SN - 978-1-4799-4791-1

BT - Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

A2 - Zhang, G.Q.

A2 - Van Driel, W.D.

A2 - Rodgers, P.

A2 - Bailey, C.

A2 - de Saint Leger, O.

PB - Institute of Electrical and Electronics Engineers

T2 - 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

Y2 - 7 April 2014 through 9 April 2014

ER -

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