Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
Publikationen
- 2023
- Veröffentlicht
Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection
Handler, J., Ninevski, D. & O'Leary, P., Okt. 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics EngineersPublikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
A Rayleigh-Ritz Autoencoder
Terbuch, A., O'Leary, P., Ninevski, D., Hagendorfer, E. J., Schlager, E., Windisch, A. & Schweimer, C., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics Engineers, S. 1-6Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Automatic Synthesis of Admissible Functions for Variational Learning
O'Leary, P., Ninevski, D. & Terbuch, A., 2023, 2023 IEEE International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA 2023). Institute of Electrical and Electronics EngineersPublikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Improved Predictive Model for Surge/Swab Pressure Estimation using a New Simplified (NS) Model
Ridha, S., Khanbesh, S., Arain, A. H., Yusuf, M. & Krishna, S., 2023, 2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023. Institute of Electrical and Electronics Engineers, (2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Improved nanoindentation methods for polymer based multilayer film cross-sections
Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D. & Teichert, C., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Instrumented Milling Process and Analysis for Tool Wear Measurement
Ninevski, D., Yifrach, Y. & O'Leary, P., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics EngineersPublikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
The Influence of Isolation on Learning in an Immersive Laboratory Environment
Holly, M., Sommer, S., Ruh, T., Stadlbauer, D., Rameshan, C. & Pirker, J., 2023, International Conference on Advanced Learning Technologies (ICALT). Chang, M., Chen, N-S., Kuo, R., Rudolph, G., Sampson, D. G. & Tlili, A. (Hrsg.). Institute of Electrical and Electronics Engineers, Band 2023. S. 285-289 5 S. (2023 IEEE International Conference on Advanced Learning Technologies (ICALT)).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts
Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2022
- Veröffentlicht
A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Application of Artificial Neural Network to Predict the Thermal and Thermomechanical Behavior of Refractory Linings
Hou, A., Jin, S., Gruber, D. & Harmuth, H., 2022, 2022 International Joint Conference on Neural Networks, IJCNN 2022 - Proceedings. Institute of Electrical and Electronics Engineers, (Proceedings of the International Joint Conference on Neural Networks; Band 2022-July).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband