Institute of Electrical and Electronics Engineers

Herausgeber (Verlag): Verlag/Herausgebende InstitutionHerausgeber (Verlag)

Publikationen

  1. 2024
  2. Veröffentlicht

    A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

    Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  3. Veröffentlicht

    Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

    Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  4. 2023
  5. Veröffentlicht

    Modelling Periodic Measurement Data Having a Piecewise Polynomial Trend Using the Method of Variable Projection

    Handler, J., Ninevski, D. & O'Leary, P., Okt. 2023, IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  6. H∞-Based Double Grid Forming Controller of Multi-Modular Converters in a Hybrid AC/DC Grid

    Eder, B. P., Adolfo, A., Markus, M. & Florian, D., 25 Juni 2023, 2023 IEEE 24th Workshop on Control and Modeling for Power Electronics, COMPEL 2023. Institute of Electrical and Electronics Engineers, (2023 IEEE 24th Workshop on Control and Modeling for Power Electronics, COMPEL 2023).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  7. Veröffentlicht

    A Rayleigh-Ritz Autoencoder

    Terbuch, A., O'Leary, P., Ninevski, D., Hagendorfer, E. J., Schlager, E., Windisch, A. & Schweimer, C., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics Engineers, S. 1-6

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  8. Veröffentlicht

    Automatic Synthesis of Admissible Functions for Variational Learning

    O'Leary, P., Ninevski, D. & Terbuch, A., 2023, 2023 IEEE International Conference on Computational Intelligence and Virtual Environments for Measurement Systems and Applications (CIVEMSA 2023). Institute of Electrical and Electronics Engineers

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  9. Veröffentlicht

    Identifying the potential of SiC technology for PV inverters

    Eskilson, T., Jehle, A., Schmidt, P., Makoschitz, M. & Baumgartner, F., 2023, 2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe. Institute of Electrical and Electronics Engineers, (2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  10. Veröffentlicht

    Improved nanoindentation methods for polymer based multilayer film cross-sections

    Christoefl, P., Jakes, J. E., Geier, J., Pinter, G., Oreski, G., Stone, D. & Teichert, C., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  11. Veröffentlicht

    Improved Predictive Model for Surge/Swab Pressure Estimation using a New Simplified (NS) Model

    Ridha, S., Khanbesh, S., Arain, A. H., Yusuf, M. & Krishna, S., 2023, 2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023. Institute of Electrical and Electronics Engineers, (2023 International Conference on Digital Business and Technology Management, ICONDBTM 2023).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  12. Veröffentlicht

    Instrumented Milling Process and Analysis for Tool Wear Measurement

    Ninevski, D., Yifrach, Y. & O'Leary, P., 2023, 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) (I2MTC 2023). Kuala Lumpur, Malaysia: Institute of Electrical and Electronics Engineers

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

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