Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
71 - 76 von 76Seitengröße: 10
Publikationen
- 2015
- Veröffentlicht
Fracture mechanics of thin film systems on the sub-micron scale
Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 Mai 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Topology survey of DC-Side-enhanced passive rectifier circuits for low-harmonic input currents and improved power factor
Makoschitz, M., Hartmann, M. & Ertl, H., 2015, PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of. Institute of Electrical and Electronics Engineers, 7149189. (PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2014
DC voltage balancing of flying converter cell active rectifier
Makoschitz, M., Hartmann, M., Ertl, H. & Fehringer, R., 11 Nov. 2014, 2014 IEEE Energy Conversion Congress and Exposition, ECCE 2014. Institute of Electrical and Electronics Engineers, S. 4071-4078 8 S. 6953956. (2014 IEEE Energy Conversion Congress and Exposition, ECCE 2014).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Design and experimental verification of a third harmonic injection rectifier circuit using a Flying converter cell
Hartmann, M., Fehringer, R., Makoschitz, M. & Ertl, H., 2014, APEC 2014 - 29th Annual IEEE Applied Power Electronics Conference and Exposition. Institute of Electrical and Electronics Engineers, S. 920-927 8 S. 6803418. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method
Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (Hrsg.). Institute of Electrical and Electronics Engineers, 6813785Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2013
- Veröffentlicht
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr. 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband