Institute of Electrical and Electronics Engineers
Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)
51 - 55 von 55Seitengröße: 10
Publikationen
- 2015
- Veröffentlicht
Robust machine vision based displacement analysis for tunnel boring machines
Gugg, C. & O'Leary, P., 6 Juli 2015, Conference Record - IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers, Band 2015-July. S. 875-880 6 S. 7151384Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
The influence of surface modification on the electrical properties of silicon carbide flakes
Pleşa, I., Schlögl, S., Radl, S. V., Mühlbacher, I. & Schichler, U., 24 Juni 2015, 2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015. Institute of Electrical and Electronics Engineers, S. 460-463 4 S. 7133858. (2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Fracture mechanics of thin film systems on the sub-micron scale
Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 Mai 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2014
- Veröffentlicht
Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method
Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (Hrsg.). Institute of Electrical and Electronics Engineers, 6813785Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2013
- Veröffentlicht
Multi-physics simulation of the component attachment within embedding process
Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr. 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
