Institute of Electrical and Electronics Engineers

Publisher

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Research output

  1. 2015
  2. Published

    Robust machine vision based displacement analysis for tunnel boring machines

    Gugg, C. & O'Leary, P., 6 Jul 2015, Conference Record - IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers, Vol. 2015-July. p. 875-880 6 p. 7151384

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. The influence of surface modification on the electrical properties of silicon carbide flakes

    Pleşa, I., Schlögl, S., Radl, S. V., Mühlbacher, I. & Schichler, U., 24 Jun 2015, 2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015. Institute of Electrical and Electronics Engineers, p. 460-463 4 p. 7133858. (2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. Published

    Fracture mechanics of thin film systems on the sub-micron scale

    Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 May 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  5. 2014
  6. Published

    Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

    Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. 2013
  8. Published

    Multi-physics simulation of the component attachment within embedding process

    Macurova, K., Kharicha, A., Pletz, M., Mataln, M., Bermejo, R., Schongrundner, R., Krivec, T., Antretter, T., Maia, W., Morianz, M. & Brizoux, M., 1 Apr 2013, 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. Institute of Electrical and Electronics Engineers, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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