Institute of Electrical and Electronics Engineers

Herausgeber (Verlag): Verlag/Herausgebende Institution › Herausgeber (Verlag)

61 - 70 von 74Seitengröße: 10
Sortieren nach: Erscheinungsjahr

Publikationen

  1. 2016
  2. Veröffentlicht

    Fracture and Material Behavior of Thin Film composites

    Kozic, D., Konetschnik, R., Maier-Kiener, V., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) . Institute of Electrical and Electronics Engineers, S. 1-6 6 S.

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  3. 2015

  4. Effects of unbalanced mains voltage conditions on three-phase hybrid rectifiers employing third harmonic injection

    Makoschitz, M., Hartmanny, M. & Ertl, H., 2 Nov. 2015, Proceedings - 2015 International Symposium on Smart Electric Distribution Systems and Technologies, EDST 2015. Institute of Electrical and Electronics Engineers, S. 417-424 8 S. 7315245. (Proceedings - 2015 International Symposium on Smart Electric Distribution Systems and Technologies, EDST 2015).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  5. A passive three-phase rectifier enhanced by a DC-side high switching frequency add-on SiC-converter stage for unity power factor applications

    Makoschitz, M., Ertl, H. & Hartmann, M., 27 Okt. 2015, 2015 17th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2015. Institute of Electrical and Electronics Engineers, 7309327. (2015 17th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2015).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  6. Elektronische Veröffentlichung vor Drucklegung.

    An Algebraic Framework for the Real-Time Solution of Inverse Problems on Embedded Systems

    Gugg, C., Harker, M., O'Leary, P. & Rath, G., 26 Aug. 2015, (Elektronische Veröffentlichung vor Drucklegung.) 12th IEEE International Conference on Embedded Software and Systems. Institute of Electrical and Electronics Engineers, S. 1097 - 1102 15635204

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  7. Veröffentlicht

    An inverse problem approach to approximating sensor data in cyber physical systems

    O'Leary, P., Harker, M. & Gugg, C., 6 Juli 2015, Conference Record - IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers, Band 2015-July. S. 1717-1722 6 S. 7151539

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  8. Veröffentlicht

    Robust machine vision based displacement analysis for tunnel boring machines

    Gugg, C. & O'Leary, P., 6 Juli 2015, Conference Record - IEEE Instrumentation and Measurement Technology Conference. Institute of Electrical and Electronics Engineers, Band 2015-July. S. 875-880 6 S. 7151384

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  9. The influence of surface modification on the electrical properties of silicon carbide flakes

    Pleşa, I., Schlögl, S., Radl, S. V., Mühlbacher, I. & Schichler, U., 24 Juni 2015, 2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015. Institute of Electrical and Electronics Engineers, S. 460-463 4 S. 7133858. (2015 9th International Symposium on Advanced Topics in Electrical Engineering, ATEE 2015).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  10. Analysis of a three-phase flying converter cell rectifier operating in light/no-load condition

    Makoschitz, M., Hartmann, M. & Ertl, H., 8 Mai 2015, APEC 2015 - 30th Annual IEEE Applied Power Electronics Conference and Exposition. May Aufl. Institute of Electrical and Electronics Engineers, S. 92-100 9 S. 7104337. (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC; Band 2015-May, Nr. May).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  11. Veröffentlicht

    Fracture mechanics of thin film systems on the sub-micron scale

    Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T. & Ganser, H. P., 6 Mai 2015, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers, 7103088

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  12. Topology survey of DC-Side-enhanced passive rectifier circuits for low-harmonic input currents and improved power factor

    Makoschitz, M., Hartmann, M. & Ertl, H., 2015, PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of. Institute of Electrical and Electronics Engineers, 7149189. (PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Vorherige 1...3 4 5 6 7 8 Nächste
Beziehungsdiagramm anzeigen