Unified Software Interface for Numerical Evaluation of Integrals and Derivatives of Fractional Order

Skovranek, T., Harker, M., Podlubny, I., O'Leary, P. & Petras, I., 27 Okt. 2020, Proceedings of the 2020 21st International Carpathian Control Conference, ICCC 2020. Petras, I. & Kacur, J. (Hrsg.). Institute of Electrical and Electronics Engineers, 9257225. (Proceedings of the 2020 21st International Carpathian Control Conference, ICCC 2020).

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Oscillation Damping With Input Shaping in Individual Metering Hydraulic Systems

Rath, G., Zaev, E. & Babunski, D., 1 Juni 2019, 2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings. Stojanovic, R., Jozwiak, L., Lutovac, B. & Jurisic, D. (Hrsg.). Institute of Electrical and Electronics Engineers, 8760056. (2019 8th Mediterranean Conference on Embedded Computing, MECO 2019 - Proceedings).

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Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 Mai 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, S. 2029-2035 7 S. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

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Simultaneous approximation of measurement values and derivative data using discrete orthogonal polynomials

Ritt, R., Harker, M. & O'Leary, P., 1 Mai 2019, Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019. Institute of Electrical and Electronics Engineers, S. 282-289 8 S. 8780356. (Proceedings - 2019 IEEE International Conference on Industrial Cyber Physical Systems, ICPS 2019).

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Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers

Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 März 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).

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Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov. 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

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Numerical Investigation of Collective Motion of Cathode Spots

Kharicha, A., Karimi-Sibaki, E., Ludwig, A. & Wu, M., 15 Nov. 2018, 28th International Symposium on Discharges and Electrical Insulation in Vacuum: ISDEIV. Institute of Electrical and Electronics Engineers, Band 2. S. 467-469 3 S. (International Symposium on Discharges and Elevtrical Insultaion in Vacuum, ISDEIV).

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Force and acoustic emission measurements for condition monitoring of fine blanking tools

Kollment, W., O'Leary, P., Harker, M., Klunsner, T. & Eck, S., 10 Juli 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.

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Real-time tensor polynomial approximation of crosshatch measured geometric surface data

Harker, M., O'Leary, P., Plessing, L., Hergan, P. & Fauster, E., 10 Juli 2018, I2MTC 2018 - 2018 IEEE International Instrumentation and Measurement Technology Conference: Discovering New Horizons in Instrumentation and Measurement, Proceedings. Institute of Electrical and Electronics Engineers, S. 1-6 6 S.

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