Estimating Parameters of a Sine Wave by the Method of Variable Projection

O'Leary, P. & Ninevski, D., 17 Mai 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. Institute of Electrical and Electronics Engineers, 9459842. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Band 2021-May).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Instrumentation of a Roving Inspection Test Rig with Surface Geometry Measurement of Fiber Bundles

Lehner, S., Neunkirchen, S., Fauster, E. & O'Leary, P., 17 Mai 2021, I2MTC 2021 - IEEE International Instrumentation and Measurement Technology Conference, Proceedings. IEEE Xplore (online): Institute of Electrical and Electronics Engineers, 9459889. (Conference Record - IEEE Instrumentation and Measurement Technology Conference; Band 2021-May).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Learning to Drive with Deep Reinforcement Learning

Chukamphaeng, N., Pasupa, K., Antenreiter, M. & Auer, P., 21 Jan. 2021, KST 2021 - 2021 13th International Conference Knowledge and Smart Technology. Institute of Electrical and Electronics Engineers, S. 147-152 6 S. 9415770. (KST 2021 - 2021 13th International Conference Knowledge and Smart Technology).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

A Flexible CAEX Based Model for Standard Integration in Tunnelling

Paskaleva, G., Mazak-Huemer, A., Waldhart, J. & Ehrbar, H., 2021, 2021 ETFA – IEEE 26th International Conference on Emerging Technologies and Factory Automation. Institute of Electrical and Electronics Engineers, S. 1-8 8 S.

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Grid Load Mitigation in EV Fast Charging Stations Through Integration of a High-Performance Flywheel Energy Storage System with CFRP Rotor

Buchroithner, A., Presmair, R., Haidl, P., Wegleiter, H., Thormann, B., Kienberger, T., Auer, P. & Domitner, J., 2021, 2021 IEEE Green Energy and Smart Systems Conference, IGESSC 2021. Institute of Electrical and Electronics Engineers, (2021 IEEE Green Energy and Smart Systems Conference, IGESSC 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

PermeabilityNets: Comparing Neural Network Architectures on a Sequence-to-Instance Task in CFRP Manufacturing

Stieber, S., Schroter, N., Fauster, E., Schiendorfer, A. & Reif, W., 2021, Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021. Wani, M. A., Sethi, I. K., Shi, W., Qu, G., Raicu, D. S. & Jin, R. (Hrsg.). Institute of Electrical and Electronics Engineers, S. 694-697 4 S. (Proceedings - 20th IEEE International Conference on Machine Learning and Applications, ICMLA 2021).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dez. 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, S. 380-385 6 S. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

A novel method for solving an optimal control problem for a numerically stiff independent metering system

Stojanoski, G., Ninevski, D., Rath, G. & Harker, M., 26 Nov. 2020, 2020 Australian and New Zealand Control Conference, ANZCC 2020. Institute of Electrical and Electronics Engineers, S. 108-113 6 S. 9318391. (2020 Australian and New Zealand Control Conference, ANZCC 2020).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband