Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Autoren
Organisationseinheiten
Externe Organisationseinheiten
- Polymer Competence Center Leoben GmbH
- Austria Technologie Systemtechnik Aktiengesellschaft
- Vitesco Technologies
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
| ISBN (elektronisch) | 9781665413732 |
| ISBN (Print) | 9781665413732 |
| DOIs | |
| Status | Veröffentlicht - 19 Apr. 2021 |
| Veranstaltung | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta Dauer: 19 Apr. 2021 → 21 Apr. 2021 |
Publikationsreihe
| Name | 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
|---|
Konferenz
| Konferenz | 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 |
|---|---|
| Land/Gebiet | Malta |
| Ort | St. Julian |
| Zeitraum | 19/04/21 → 21/04/21 |
