Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Standard
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 2021. 9410855 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Harvard
APA
Vancouver
Author
Bibtex - Download
}
RIS (suitable for import to EndNote) - Download
TY - GEN
T1 - Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
AU - Schipfer, Christian
AU - Gschwandl, Mario
AU - Fuchs, Peter
AU - Antretter, Thomas
AU - Feuchter, Michael
AU - Morak, Matthias
AU - Tao, Qi
AU - Schingale, Angelika
N1 - Publisher Copyright: © 2021 IEEE.
PY - 2021/4/19
Y1 - 2021/4/19
UR - http://www.scopus.com/inward/record.url?scp=85105547315&partnerID=8YFLogxK
UR - https://pure.unileoben.ac.at/portal/en/publications/prediction-of-curing-induced-residual-stresses-in-polymeric-encapsulation-materials-for-microelectronics(a6a52a01-3aa2-42a1-8dd7-dd9f2b9c0f57).html
U2 - 10.1109/EuroSimE52062.2021.9410855
DO - 10.1109/EuroSimE52062.2021.9410855
M3 - Conference contribution
AN - SCOPUS:85105547315
SN - 9781665413732
T3 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
BT - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
PB - Institute of Electrical and Electronics Engineers
T2 - 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Y2 - 19 April 2021 through 21 April 2021
ER -