Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Standard

Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. / Schipfer, Christian; Gschwandl, Mario; Fuchs, Peter et al.
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 2021. 9410855 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Harvard

Schipfer, C, Gschwandl, M, Fuchs, P, Antretter, T, Feuchter, M, Morak, M, Tao, Q & Schingale, A 2021, Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. in 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021., 9410855, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021, Institute of Electrical and Electronics Engineers, 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021, St. Julian, Malta, 19/04/21. https://doi.org/10.1109/EuroSimE52062.2021.9410855

APA

Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q., & Schingale, A. (2021). Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 Article 9410855 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE52062.2021.9410855

Vancouver

Schipfer C, Gschwandl M, Fuchs P, Antretter T, Feuchter M, Morak M et al. Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. In 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers. 2021. 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021). doi: 10.1109/EuroSimE52062.2021.9410855

Author

Schipfer, Christian ; Gschwandl, Mario ; Fuchs, Peter et al. / Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics. 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 2021. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

Bibtex - Download

@inproceedings{a6a52a013aa242a18dd7dd9f2b9c0f57,
title = "Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics",
author = "Christian Schipfer and Mario Gschwandl and Peter Fuchs and Thomas Antretter and Michael Feuchter and Matthias Morak and Qi Tao and Angelika Schingale",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 ; Conference date: 19-04-2021 Through 21-04-2021",
year = "2021",
month = apr,
day = "19",
doi = "10.1109/EuroSimE52062.2021.9410855",
language = "English",
isbn = "9781665413732",
series = "2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

AU - Schipfer, Christian

AU - Gschwandl, Mario

AU - Fuchs, Peter

AU - Antretter, Thomas

AU - Feuchter, Michael

AU - Morak, Matthias

AU - Tao, Qi

AU - Schingale, Angelika

N1 - Publisher Copyright: © 2021 IEEE.

PY - 2021/4/19

Y1 - 2021/4/19

UR - http://www.scopus.com/inward/record.url?scp=85105547315&partnerID=8YFLogxK

UR - https://pure.unileoben.ac.at/portal/en/publications/prediction-of-curing-induced-residual-stresses-in-polymeric-encapsulation-materials-for-microelectronics(a6a52a01-3aa2-42a1-8dd7-dd9f2b9c0f57).html

U2 - 10.1109/EuroSimE52062.2021.9410855

DO - 10.1109/EuroSimE52062.2021.9410855

M3 - Conference contribution

AN - SCOPUS:85105547315

SN - 9781665413732

T3 - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

BT - 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

PB - Institute of Electrical and Electronics Engineers

T2 - 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

Y2 - 19 April 2021 through 21 April 2021

ER -

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