Characterization and modeling of a typical curing material for photoresist films
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Polymer Competence Center Leoben GmbH
- International Center for Numerical Methods in Engineering
Details
| Original language | English |
|---|---|
| Title of host publication | 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 |
| Publisher | Institute of Electrical and Electronics Engineers |
| ISBN (electronic) | 9781665458368 |
| DOIs | |
| Publication status | Published - 2022 |
| Event | 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 - St Julian, Malta Duration: 25 Apr 2022 → 27 Apr 2022 |
Publication series
| Name | 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 |
|---|
Conference
| Conference | 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 |
|---|---|
| Country/Territory | Malta |
| City | St Julian |
| Period | 25/04/22 → 27/04/22 |
