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Mario Gschwandl
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Mario Gschwandl
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Latest Research Output
Characterization and modeling of a typical curing material for photoresist films
Research output
:
Chapter in Book/Report/Conference proceeding
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Conference contribution
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Research output
:
Chapter in Book/Report/Conference proceeding
›
Conference contribution
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Research output
:
Chapter in Book/Report/Conference proceeding
›
Conference contribution
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