Characterization and modeling of a typical curing material for photoresist films
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Autoren
Organisationseinheiten
Externe Organisationseinheiten
- Polymer Competence Center Leoben GmbH
- International Center for Numerical Methods in Engineering
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
| ISBN (elektronisch) | 9781665458368 |
| DOIs | |
| Status | Veröffentlicht - 2022 |
| Veranstaltung | 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 - St Julian, Malta Dauer: 25 Apr. 2022 → 27 Apr. 2022 |
Publikationsreihe
| Name | 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 |
|---|
Konferenz
| Konferenz | 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 |
|---|---|
| Land/Gebiet | Malta |
| Ort | St Julian |
| Zeitraum | 25/04/22 → 27/04/22 |
