Characterization and modeling of a typical curing material for photoresist films

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Characterization and modeling of a typical curing material for photoresist films. / Peng, Chongnan; Morak, Matthias; Thalhamer, Andreas et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

Harvard

Peng, C, Morak, M, Thalhamer, A, Gschwandl, M, Fuchs, P, Tao, Q, Krivec, T, Antretter, T & Celigueta, MA 2022, Characterization and modeling of a typical curing material for photoresist films. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, Institute of Electrical and Electronics Engineers, 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022, St Julian, Malta, 25/04/22. https://doi.org/10.1109/EuroSimE54907.2022.9758849

APA

Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T., & Celigueta, M. A. (2022). Characterization and modeling of a typical curing material for photoresist films. In 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/EuroSimE54907.2022.9758849

Vancouver

Peng C, Morak M, Thalhamer A, Gschwandl M, Fuchs P, Tao Q et al. Characterization and modeling of a typical curing material for photoresist films. in 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers. 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022). doi: 10.1109/EuroSimE54907.2022.9758849

Author

Peng, Chongnan ; Morak, Matthias ; Thalhamer, Andreas et al. / Characterization and modeling of a typical curing material for photoresist films. 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

Bibtex - Download

@inproceedings{a33717d6919b42a188643937b0e30c7b,
title = "Characterization and modeling of a typical curing material for photoresist films",
author = "Chongnan Peng and Matthias Morak and Andreas Thalhamer and Mario Gschwandl and Peter Fuchs and Qi Tao and Thomas Krivec and Thomas Antretter and Celigueta, {Miguel Angel}",
note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022 ; Conference date: 25-04-2022 Through 27-04-2022",
year = "2022",
doi = "10.1109/EuroSimE54907.2022.9758849",
language = "English",
series = "2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022",
publisher = "Institute of Electrical and Electronics Engineers",
booktitle = "2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022",
address = "United States",

}

RIS (suitable for import to EndNote) - Download

TY - GEN

T1 - Characterization and modeling of a typical curing material for photoresist films

AU - Peng, Chongnan

AU - Morak, Matthias

AU - Thalhamer, Andreas

AU - Gschwandl, Mario

AU - Fuchs, Peter

AU - Tao, Qi

AU - Krivec, Thomas

AU - Antretter, Thomas

AU - Celigueta, Miguel Angel

N1 - Publisher Copyright: © 2022 IEEE.

PY - 2022

Y1 - 2022

UR - http://www.scopus.com/inward/record.url?scp=85129509274&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE54907.2022.9758849

DO - 10.1109/EuroSimE54907.2022.9758849

M3 - Conference contribution

AN - SCOPUS:85129509274

T3 - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

BT - 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

PB - Institute of Electrical and Electronics Engineers

T2 - 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022

Y2 - 25 April 2022 through 27 April 2022

ER -

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