Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

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A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

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Application of Artificial Neural Network to Predict the Thermal and Thermomechanical Behavior of Refractory Linings

Hou, A., Jin, S., Gruber, D. & Harmuth, H., 2022, 2022 International Joint Conference on Neural Networks, IJCNN 2022 - Proceedings. Institute of Electrical and Electronics Engineers, (Proceedings of the International Joint Conference on Neural Networks; Band 2022-July).

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Characterization and modeling of a typical curing material for photoresist films

Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

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Dynamic Mechanical Response in Epoxy Nanocomposites Incorporating Various Nano-Silica Architectures

Chaudhary, S., Vryonis, O., Vaughan, A. S., Andritsch, T. & Feuchter, M., 2022, ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings. Institute of Electrical and Electronics Engineers, S. 86-89 4 S. (ICD 2022 - IEEE 2022 4th International Conference on Dielectrics, Proceedings).

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Hybrid Machine Learning for Anomaly Detection in Industrial Time-Series Measurement Data

Terbuch, A., O'Leary, P. & Auer, P., 2022, I2MTC 2022 - IEEE International Instrumentation and Measurement Technology Conference: Instrumentation and Measurement under Pandemic Constraints, Proceedings. Institute of Electrical and Electronics Engineers, (Conference Record - IEEE Instrumentation and Measurement Technology Conference).

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System Identification under General Norms for Linear Parameter Varying State-Space Systems via Sparse Matrix Methods

Harker, M. & Rath, G., 2022, 2022 IEEE/SICE International Symposium on System Integration, SII 2022. Institute of Electrical and Electronics Engineers, S. 317-322 6 S. (2022 IEEE/SICE International Symposium on System Integration, SII 2022).

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Decomposition of a Periodic Perturbed Signal with Unknown Perturbation Frequency by the Method of Variable Projection

Handler, J., Ninevski, D. & O'Leary, P., 20 Dez. 2021, 2021 7th International Conference on Mechanical Engineering and Automation ICMEAS 2021. Institute of Electrical and Electronics Engineers

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A probabilistic approach for complete coverage path planning with low-cost systems

Rottmann, N., Denz, R., Bruder, R. & Rueckert, E., Aug. 2021, 2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings. Institute of Electrical and Electronics Engineers, (2021 10th European Conference on Mobile Robots, ECMR 2021 - Proceedings).

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Investigating the influence of surface hardness and energy on the perceived stickiness of polymer coatings.

Griesser, M., Ules, T., Schlogl, S. & Gruber, D. P., 6 Juli 2021, 2021 IEEE World Haptics Conference, WHC 2021. Institute of Electrical and Electronics Engineers, S. 1148 1 S. (2021 IEEE World Haptics Conference, WHC 2021).

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