Fracture mechanics of thin film systems on the sub-micron scale
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Autoren
Organisationseinheiten
Externe Organisationseinheiten
- Materials Center Leoben Forschungs GmbH
- Empa -Swiss Federal Laboratories for Materials Science and Technology, Thun
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
| ISBN (Print) | 9781479999507 |
| DOIs | |
| Status | Veröffentlicht - 6 Mai 2015 |
| Veranstaltung | 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Budapest, Ungarn Dauer: 19 Apr. 2015 → 22 Apr. 2015 |
Konferenz
| Konferenz | 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
|---|---|
| Kurztitel | EuroSimE 2015 |
| Land/Gebiet | Ungarn |
| Ort | Budapest |
| Zeitraum | 19/04/15 → 22/04/15 |
