Multi-physics simulation of the component attachment within embedding process
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Autoren
Organisationseinheiten
Externe Organisationseinheiten
- Materials Center Leoben Forschungs GmbH
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
| Seiten | 1-6 |
| Seitenumfang | 6 |
| ISBN (Print) | 978-1-4673-6138-5 |
| DOIs | |
| Status | Veröffentlicht - 1 Apr. 2013 |
| Veranstaltung | 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Wroclaw, Polen Dauer: 15 Apr. 2013 → 17 Apr. 2013 |
Konferenz
| Konferenz | 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
|---|---|
| Kurztitel | EuroSimE 2013 |
| Land/Gebiet | Polen |
| Ort | Wroclaw |
| Zeitraum | 15/04/13 → 17/04/13 |
