A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies
Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
Autoren
Organisationseinheiten
Externe Organisationseinheiten
- Polymer Competence Center Leoben GmbH
- Institute of Mechanics
- Christian Doppler Labor für Betriebsfestigkeit, Leoben
- AT&S - Austria Technologie & Systemtechnik Aktiengesselschaft Leoben
Details
| Originalsprache | Englisch |
|---|---|
| Titel | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
| Herausgeber (Verlag) | Institute of Electrical and Electronics Engineers |
| ISBN (elektronisch) | 9798350393637 |
| DOIs | |
| Status | Veröffentlicht - 2024 |
| Veranstaltung | 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 - Catania, Italien Dauer: 7 Apr. 2024 → 10 Apr. 2024 |
Publikationsreihe
| Name | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
|---|
Konferenz
| Konferenz | 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024 |
|---|---|
| Land/Gebiet | Italien |
| Ort | Catania |
| Zeitraum | 7/04/24 → 10/04/24 |
