Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- Materials Center Leoben Forschungs GmbH
Details
| Original language | Undefined/Unknown |
|---|---|
| Pages (from-to) | 4196-4205 |
| Number of pages | 10 |
| Journal | Materials Today: Proceedings |
| Volume | 2 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 2015 |
