By the same authors

• Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

  Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

• Investigation of probable squat growth from initial surface cracks in rails using a three-dimensional rollover simulation

  Research output: Contribution to journal › Article › Research › peer-review

• A Chemo-Mechanically Coupled Model for the Prediction of Phase Segregation and Pore Formation in Microelectronic Solders

  Research output: Contribution to conference › Presentation › Research › peer-review