Stress and Deflection Development During Die Embedding into Printed Circuit Boards
Research output: Contribution to journal › Article › Research › peer-review
Standard
Stress and Deflection Development During Die Embedding into Printed Circuit Boards. / Macurova, Katerina; Angerer, Paul; Bermejo, Raul et al.
In: Materials Today: Proceedings, Vol. 2, No. 2, 2015, p. 4196-4205.
In: Materials Today: Proceedings, Vol. 2, No. 2, 2015, p. 4196-4205.
Research output: Contribution to journal › Article › Research › peer-review
Harvard
Macurova, K, Angerer, P, Bermejo, R, Pletz, M, Schöngrundner, R, Antretter, T, Krivec, T, Morianz, M, Brizoux, M & Lecavelier, A 2015, 'Stress and Deflection Development During Die Embedding into Printed Circuit Boards', Materials Today: Proceedings, vol. 2, no. 2, pp. 4196-4205. https://doi.org/10.1016/j.matpr.2015.09.003
APA
Macurova, K., Angerer, P., Bermejo, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M., & Lecavelier, A. (2015). Stress and Deflection Development During Die Embedding into Printed Circuit Boards. Materials Today: Proceedings, 2(2), 4196-4205. https://doi.org/10.1016/j.matpr.2015.09.003
Vancouver
Macurova K, Angerer P, Bermejo R, Pletz M, Schöngrundner R, Antretter T et al. Stress and Deflection Development During Die Embedding into Printed Circuit Boards. Materials Today: Proceedings. 2015;2(2):4196-4205. doi: http://dx.doi.org/10.1016/j.matpr.2015.09.003
Author
Bibtex - Download
@article{c864fc045f0e4659ada9ae50274e6d27,
title = "Stress and Deflection Development During Die Embedding into Printed Circuit Boards",
author = "Katerina Macurova and Paul Angerer and Raul Bermejo and Martin Pletz and Ronald Sch{\"o}ngrundner and Thomas Antretter and Thomas Krivec and Mike Morianz and Michel Brizoux and A. Lecavelier",
year = "2015",
doi = "http://dx.doi.org/10.1016/j.matpr.2015.09.003",
language = "Undefined/Unknown",
volume = "2",
pages = "4196--4205",
journal = "Materials Today: Proceedings",
publisher = "Elsevier",
number = "2",
}
RIS (suitable for import to EndNote) - Download
TY - JOUR
T1 - Stress and Deflection Development During Die Embedding into Printed Circuit Boards
AU - Macurova, Katerina
AU - Angerer, Paul
AU - Bermejo, Raul
AU - Pletz, Martin
AU - Schöngrundner, Ronald
AU - Antretter, Thomas
AU - Krivec, Thomas
AU - Morianz, Mike
AU - Brizoux, Michel
AU - Lecavelier, A.
PY - 2015
Y1 - 2015
U2 - http://dx.doi.org/10.1016/j.matpr.2015.09.003
DO - http://dx.doi.org/10.1016/j.matpr.2015.09.003
M3 - Article
VL - 2
SP - 4196
EP - 4205
JO - Materials Today: Proceedings
JF - Materials Today: Proceedings
IS - 2
ER -
