Stress and Deflection Development During Die Embedding into Printed Circuit Boards

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

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Stress and Deflection Development During Die Embedding into Printed Circuit Boards. / Macurova, Katerina; Angerer, Paul; Bermejo, Raul et al.
in: Materials Today: Proceedings, Jahrgang 2, Nr. 2, 2015, S. 4196-4205.

Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

Vancouver

Macurova K, Angerer P, Bermejo R, Pletz M, Schöngrundner R, Antretter T et al. Stress and Deflection Development During Die Embedding into Printed Circuit Boards. Materials Today: Proceedings. 2015;2(2):4196-4205. doi: http://dx.doi.org/10.1016/j.matpr.2015.09.003

Bibtex - Download

@article{c864fc045f0e4659ada9ae50274e6d27,
title = "Stress and Deflection Development During Die Embedding into Printed Circuit Boards",
author = "Katerina Macurova and Paul Angerer and Raul Bermejo and Martin Pletz and Ronald Sch{\"o}ngrundner and Thomas Antretter and Thomas Krivec and Mike Morianz and Michel Brizoux and A. Lecavelier",
year = "2015",
doi = "http://dx.doi.org/10.1016/j.matpr.2015.09.003",
language = "Undefined/Unknown",
volume = "2",
pages = "4196--4205",
journal = "Materials Today: Proceedings",
publisher = "Elsevier",
number = "2",

}

RIS (suitable for import to EndNote) - Download

TY - JOUR

T1 - Stress and Deflection Development During Die Embedding into Printed Circuit Boards

AU - Macurova, Katerina

AU - Angerer, Paul

AU - Bermejo, Raul

AU - Pletz, Martin

AU - Schöngrundner, Ronald

AU - Antretter, Thomas

AU - Krivec, Thomas

AU - Morianz, Mike

AU - Brizoux, Michel

AU - Lecavelier, A.

PY - 2015

Y1 - 2015

U2 - http://dx.doi.org/10.1016/j.matpr.2015.09.003

DO - http://dx.doi.org/10.1016/j.matpr.2015.09.003

M3 - Article

VL - 2

SP - 4196

EP - 4205

JO - Materials Today: Proceedings

JF - Materials Today: Proceedings

IS - 2

ER -