Vom selben Autor

• Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

  Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

• Investigation of probable squat growth from initial surface cracks in rails using a three-dimensional rollover simulation

  Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

• A Chemo-Mechanically Coupled Model for the Prediction of Phase Segregation and Pore Formation in Microelectronic Solders

  Publikationen: Konferenzbeitrag › Vortrag › Forschung › (peer-reviewed)