Determination of cyclic mechanical properties of thin copper layers for PCB applications
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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| Translated title of the contribution | Determination of cyclic mechanical properties of thin copper layers for PCB applications |
|---|---|
| Original language | English |
| Title of host publication | Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems |
| Pages | 1-8 |
| Publication status | Published - 2014 |
