Multi-physics simulation of the component attachment within embedding process
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Materials Center Leoben Forschungs GmbH
Details
| Original language | English |
|---|---|
| Title of host publication | 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 1-6 |
| Number of pages | 6 |
| ISBN (print) | 978-1-4673-6138-5 |
| DOIs | |
| Publication status | Published - 1 Apr 2013 |
| Event | EuroSimE 2013 - Wroclaw, Poland Duration: 15 Apr 2013 → 17 Apr 2013 |
Conference
| Conference | EuroSimE 2013 |
|---|---|
| Abbreviated title | EuroSimE 2013 |
| Country/Territory | Poland |
| City | Wroclaw |
| Period | 15/04/13 → 17/04/13 |
