Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 |
| Publication status | Published - 2014 |
