Method development for the cyclic characterization of thin copper layers for PCB applications
Research output: Contribution to journal › Article › Research › peer-review
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| Translated title of the contribution | Method development for the cyclic characterization of thin copper layers for PCB applications |
|---|---|
| Original language | English |
| Pages (from-to) | 53-60 |
| Journal | Circuit World |
| Volume | 40 |
| DOIs | |
| Publication status | Published - 2014 |
