Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Materials Center Leoben Forschungs GmbH
- AT and S AG
- Thales
Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 |
| Publication status | Published - 2014 |
