Characterization and modeling of the AuSnCu thin solder joint under thermal cycling
Research output: Contribution to conference › Poster › Research › peer-review
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| Translated title of the contribution | Characterization and modeling of the AuSnCu thin solder joint under thermal cycling |
|---|---|
| Original language | English |
| Publication status | Published - 2014 |
| Event | 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 - Gent, Belgium Duration: 7 Apr 2014 → 9 Apr 2014 |
Conference
| Conference | 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014 |
|---|---|
| Abbreviated title | EuroSimE 2014 |
| Country/Territory | Belgium |
| City | Gent |
| Period | 7/04/14 → 9/04/14 |
