Thomas Antretter
41 - 50 von 229Seitengröße: 10
Publikationen
- 2019
- Veröffentlicht
Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 Mai 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, S. 2029-2035 7 S. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 März 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Deformation-induced phase transformation in a Co-Cr-W-Mo alloy studied by high-energy X-ray diffraction during in-situ compression tests
Weißensteiner, I., Petersmann, M., Erdely, P., Stark, A., Antretter, T., Clemens, H. & Maier-Kiener, V., Feb. 2019, in: Acta materialia. 164.2019, February, S. 272-282 11 S.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, S. 1509-1514.Publikationen: Konferenzbeitrag › Paper › (peer-reviewed)
- Veröffentlicht
Cyclic heat-up and damage-relevant substrate plastification of single- and bilayer coated milling inserts evaluated numerically
Nemetz, A., Daves, W., Klünsner, T., Ecker, W., Schäfer, J., Czettl, C. & Antretter, T., 2019, in: Surface & coatings technology. 360.2019, February, S. 39-49 11 S.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Residual stress and microstructure evolution in steel tubes for different cooling conditions – Simulation and verification
Brunbauer, S., Winter, G., Antretter, T., Staron, P. & Ecker, W., 2019, in: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 747, S. 73-79Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Shot peening-induced plastic deformation of individual phases within a coated WC-Co hard metal composite material including WC plastification
Faksa, L., Daves, W., Klünsner, T., Maier, K., Antretter, T., Czettl, C. & Ecker, W., 2019, in: Surface & coatings technology. 380.2019, 25 December, 11 S., 125026.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Simulation of Phase Transformation and Material Plasticity for Press Hardening
Tomasch, M., Ecker, W. & Antretter, T., 2019, Proceedings of NUMIFORM 2019: the 13th International Conference on Numerical Methods in Industrial Forming Processes. S. 362-365Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- 2018
- Veröffentlicht
Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities
Kozic, D., Gänser, H-P., Brunner, R., Kiener, D., Antretter, T. & Kolednik, O., 31 Dez. 2018, in: Thin solid films. S. 14-22 9 S.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov. 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
