Thomas Antretter
41 - 50 out of 229Page size: 10
Research output
- 2019
- Published
Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Gschwandl, M., Frewein, M., Fuchs, P. F., Antretter, T., Pinter, G. & Novak, P., 5 Mar 2019, EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging. Institute of Electrical and Electronics Engineers, 8660763. (EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Deformation-induced phase transformation in a Co-Cr-W-Mo alloy studied by high-energy X-ray diffraction during in-situ compression tests
Weißensteiner, I., Petersmann, M., Erdely, P., Stark, A., Antretter, T., Clemens, H. & Maier-Kiener, V., Feb 2019, In: Acta materialia. 164.2019, February, p. 272-282 11 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
A Sequential Finite Volume Method / Finite Element Analysis of a Power Electronic Semiconductor Chip
Gschwandl, M., Fuchs, P. F., Antretter, T., Pfost, M., Mitev, I., Tao, Q., Krivec, T., Schingale, A. & Decker, M., 2019, p. 1509-1514.Research output: Contribution to conference › Paper › peer-review
- Published
Cyclic heat-up and damage-relevant substrate plastification of single- and bilayer coated milling inserts evaluated numerically
Nemetz, A., Daves, W., Klünsner, T., Ecker, W., Schäfer, J., Czettl, C. & Antretter, T., 2019, In: Surface & coatings technology. 360.2019, February, p. 39-49 11 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Residual stress and microstructure evolution in steel tubes for different cooling conditions – Simulation and verification
Brunbauer, S., Winter, G., Antretter, T., Staron, P. & Ecker, W., 2019, In: Materials science and engineering: A, Structural materials: properties, microstructure and processing. 747, p. 73-79Research output: Contribution to journal › Article › Research › peer-review
- Published
Shot peening-induced plastic deformation of individual phases within a coated WC-Co hard metal composite material including WC plastification
Faksa, L., Daves, W., Klünsner, T., Maier, K., Antretter, T., Czettl, C. & Ecker, W., 2019, In: Surface & coatings technology. 380.2019, 25 December, 11 p., 125026.Research output: Contribution to journal › Article › Research › peer-review
- Published
Simulation of Phase Transformation and Material Plasticity for Press Hardening
Tomasch, M., Ecker, W. & Antretter, T., 2019, Proceedings of NUMIFORM 2019: the 13th International Conference on Numerical Methods in Industrial Forming Processes. p. 362-365Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2018
- Published
Crack arrest in thin metallic film stacks due to material- and residual stress inhomogeneities
Kozic, D., Gänser, H-P., Brunner, R., Kiener, D., Antretter, T. & Kolednik, O., 31 Dec 2018, In: Thin solid films. p. 14-22 9 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Influence of environmental factors like temperature and humidity on MEMS packaging materials.
Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
