Thomas Antretter
11 - 20 out of 229Page size: 10
Research output
- 2023
- Published
On the road towards understanding squats: residual stress state of rails
Gschwandl, T. J., Daves, W., Antretter, T., Bucher, C. & Künstner, D., 2023, In: Procedia Structural Integrity. 46, p. 17-23 7 p.Research output: Contribution to journal › Conference article › peer-review
- Published
Prozessoptimierung mittels multiphysikalischer Modellierung des Widerstandspunktschweißens
Prabitz, K., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R., Polcik, P. & Ecker, W., 2023, XLI. Verformungskundliches Kolloquium.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Simulation of the mechanical response of the individual intermetallic phases in multi-phase γ titanium aluminides
Seligmann, B., Spörk-Erdely, P. & Antretter, T., 2023.Research output: Contribution to conference › Poster › Research
- 2022
- Published
A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK): The Best Contributions of 2022’s STACK Community Meeting at the Montanuniversitaet Leoben, Austria
Orthaber, M. (Guest ed.), Antretter, T. (Guest ed.), Orthaber, M. & Antretter, T., 8 Dec 2022, In: International journal emerging technologies in learning : iJET. 2022, Vol. 17 No. 23Research output: Contribution to journal › Special issue › Research › peer-review
- Published
Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., Dec 2022, In: Microelectronics Reliability. 139.2022, December, 9 p., 114799.Research output: Contribution to journal › Article › Research › peer-review
- E-pub ahead of print
Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics
Gschwandl, M., Friedrich, B. E., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 4 May 2022, (E-pub ahead of print) In: Microelectronics Reliability. 133.2022, June, 9 p., 114537.Research output: Contribution to journal › Article › Research › peer-review
- Published
A Technology-Enhanced ‘Assessment System for Teaching and Assessment using a Computer Algebra Kernel’ (STACK)
Orthaber, M. & Antretter, T., 2022, In: International Journal of Emerging Technologies in Learning. 17.2022, 23, p. 4-6 3 p.Research output: Contribution to journal › Article › Research › peer-review
- Published
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2021
- Published
Liquid Metal Embrittlement of Advanced High Strength Steel: Experiments and damage modeling
Prabitz, K., Asadzadeh, M. Z., Pichler, M., Antretter, T., Beal, C., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R. & Ecker, W., 21 Sept 2021, In: Materials. 14.2021, 18, 15 p., 5451.Research output: Contribution to journal › Article › Research › peer-review
- Published
Validated multi-physical finite element modelling of the spot welding process of the advanced high strength steel dp1200hd
Prabitz, K., Pichler, M., Antretter, T., Schubert, H., Hilpert, B., Gruber, M., Sierlinger, R. & Ecker, W., 18 Sept 2021, In: Materials. 14.2021, 18, 19 p., 5411.Research output: Contribution to journal › Article › Research › peer-review
