Evaluation of Digital Image Correlation Techniques for the Determination of Coefficients of Thermal Expansion for Thin Reinforced Polymers
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Polymer Competence Center Leoben GmbH
- AT and S AG
Details
| Original language | English |
|---|---|
| Title of host publication | EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging |
| Publisher | Institute of Electrical and Electronics Engineers |
| ISBN (electronic) | 9781538656426 |
| ISBN (print) | 9781538656426 |
| DOIs | |
| Publication status | Published - 5 Mar 2019 |
| Event | 20th International Conference on Electronic Materials and Packaging, EMAP 2018 - Clear Water Bay, Hong Kong Duration: 17 Dec 2018 → 20 Dec 2018 |
Publication series
| Name | EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging |
|---|
Conference
| Conference | 20th International Conference on Electronic Materials and Packaging, EMAP 2018 |
|---|---|
| Country/Territory | Hong Kong |
| City | Clear Water Bay |
| Period | 17/12/18 → 20/12/18 |
