Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Authors
Organisational units
External Organisational units
- Polymer Competence Center Leoben GmbH
- Austria-Mikro-Syst.-Intl. GmbH
- AT and S AG
Details
| Original language | English |
|---|---|
| Title of host publication | Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 |
| Publisher | Institute of Electrical and Electronics Engineers |
| Pages | 2029-2035 |
| Number of pages | 7 |
| ISBN (electronic) | 9781728114989 |
| ISBN (print) | 9781728114989 |
| DOIs | |
| Publication status | Published - 1 May 2019 |
| Event | 69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States Duration: 28 May 2019 → 31 May 2019 |
Publication series
| Name | 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) |
|---|---|
| ISSN (Print) | 0569-5503 |
Conference
| Conference | 69th IEEE Electronic Components and Technology Conference, ECTC 2019 |
|---|---|
| Country/Territory | United States |
| City | Las Vegas |
| Period | 28/05/19 → 31/05/19 |
