Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, 2019. p. 2029-2035 8811123 (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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TY - GEN
T1 - Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
AU - Yalagach, Mahesh
AU - Filipp Fuchs, Peter
AU - Wolfberger, Archim
AU - Gschwandl, Mario
AU - Antretter, Thomas
AU - Feuchter, Michael
AU - Tak, Coen
AU - Tao, Qi
PY - 2019/5/1
Y1 - 2019/5/1
KW - deformation
KW - hygro-mechanical characterization
KW - hygro-thermal
KW - hygro-thermo-mechanical simulation
KW - hygroscopic swelling
KW - solubility
UR - https://pure.unileoben.ac.at/portal/en/publications/numerical-analysis-of-the-influence-of-polymeric-materials-on-a-mems-package-performance-under-humidity-and-temperature-loads(89593b57-15d2-42df-8bf9-9220287d5bc1).html
U2 - 10.1109/ECTC.2019.00311
DO - 10.1109/ECTC.2019.00311
M3 - Conference contribution
AN - SCOPUS:85072299869
SN - 9781728114989
T3 - 2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
SP - 2029
EP - 2035
BT - Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PB - Institute of Electrical and Electronics Engineers
T2 - 69th IEEE Electronic Components and Technology Conference, ECTC 2019
Y2 - 28 May 2019 through 31 May 2019
ER -