Qi Tao

(Ehemalig)

Publikationen

  1. 2023
  2. Angenommen/In Druck

    Single-Step Kinetic Predictions Based on a Constructed Isoconversional State Diagram

    Tao, Q., Krivec, T. & Kern, W., 2023, (Angenommen/In Druck) in: Macromolecular Theory and Simulations. 2024, ??? Stand: 15. Februar, S. ??? 12 S., 2300066.

    Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

  3. 2022
  4. Veröffentlicht

    Characterization and modeling of a typical curing material for photoresist films

    Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  5. 2021
  6. Veröffentlicht

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  7. Veröffentlicht

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  8. 2019
  9. Veröffentlicht

    Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads

    Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 Mai 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, S. 2029-2035 7 S. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).

    Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

  10. 2018
  11. Veröffentlicht

    Model Free Kinetics coupled with Finite Element Method for curing simulation of thermosetting epoxy resins

    Tao, Q., Pinter, G. G., Antretter, T., Krivec, T. & Fuchs, P., 2018, in: Journal of Applied Polymer Science. S. 1-8

    Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)

  12. Veröffentlicht

    Press Cycle Time Reduction of A Reinforced Epoxy Resin and the Influence On Its Mechanical/Thermal Properties

    Tao, Q., 2018

    Publikationen: Thesis / Studienabschlussarbeiten und HabilitationsschriftenDissertation

  13. 2017
  14. Elektronische Veröffentlichung vor Drucklegung.

    Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

    Tao, Q., Pinter, G. & Krivec, T., 27 Juli 2017, (Elektronische Veröffentlichung vor Drucklegung.) in: Microelectronics Reliability. 78.2017, November, S. 396-400 5 S.

    Publikationen: Beitrag in FachzeitschriftArtikelForschung(peer-reviewed)