Qi Tao
(Former)
1 - 8 out of 8Page size: 10
Research output
- 2023
- Accepted/In press
Single-Step Kinetic Predictions Based on a Constructed Isoconversional State Diagram
Tao, Q., Krivec, T. & Kern, W., 2023, (Accepted/In press) In: Macromolecular Theory and Simulations. 2024, ??? Stand: 15. Februar, p. ??? 12 p., 2300066.Research output: Contribution to journal › Article › Research › peer-review
- 2022
- Published
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2021
- Published
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- Published
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2019
- Published
Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, p. 2029-2035 7 p. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
- 2018
- Published
Model Free Kinetics coupled with Finite Element Method for curing simulation of thermosetting epoxy resins
Tao, Q., Pinter, G. G., Antretter, T., Krivec, T. & Fuchs, P., 2018, In: Journal of Applied Polymer Science. p. 1-8Research output: Contribution to journal › Article › Research › peer-review
- Published
Press Cycle Time Reduction of A Reinforced Epoxy Resin and the Influence On Its Mechanical/Thermal Properties
Tao, Q., 2018Research output: Thesis › Doctoral Thesis
- 2017
- E-pub ahead of print
Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
Tao, Q., Pinter, G. & Krivec, T., 27 Jul 2017, (E-pub ahead of print) In: Microelectronics Reliability. 78.2017, November, p. 396-400 5 p.Research output: Contribution to journal › Article › Research › peer-review
