Klaus Fellner

(Former)

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Research output

  1. 2012
  2. Published

    Simulation des "Single Via Thermal Cycle Test" - Modellerstellung und Bestimmung der Materialeingangsparameter

    Fellner, K., 2012

    Research output: Thesis › Master's Thesis

  3. 2013
  4. Published

    Local damage simulations of printed circuit boards based on determined in plane cohesive zone parameters

    Fuchs, P. F., Pinter, G. & Fellner, K., 2013, In: Circuit World. 39, p. 60-66

    Research output: Contribution to journal › Article › Research › peer-review

  5. 2014
  6. Published

    Determination of cyclic mechanical properties of thin copper layers for PCB applications

    Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  7. Published

    Method development for the cyclic characterization of thin copper layers for PCB applications

    Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60

    Research output: Contribution to journal › Article › Research › peer-review

  8. Published

    Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads

    Fellner, K., Fuchs, P. & Pinter, G., 2014, 13th Youth Symposium on Experimental Solid Mechanics. p. 29-32

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. 2015
  10. Published

    Degradation of the electrical performance of Printed Circuit Boards (PCBs) after cyclic thermo-mechanical loading

    Fellner, K., 2015

    Research output: Thesis › Doctoral Thesis

  11. Published

    Simulation von Delamination in Mehrschichtverbunden

    Fuchs, P., Stelzer, S., Fellner, K., Pothukuchi, H. K. R. & Pinter, G., 5 Mar 2015.

    Research output: Contribution to conference › Presentation › Research

  12. E-pub ahead of print

    Cyclic mechanical behavior of thin layers of copper: A theoretical and numerical study

    Fellner, K., Antretter, T., Fuchs, P. & Pelisset, T. M. A., 8 Dec 2015, (E-pub ahead of print) In: The Journal of Strain Analysis for Engineering Design. 51.2016, 2, p. 1-9 9 p.

    Research output: Contribution to journal › Article › Research › peer-review

  13. 2016
  14. Published

    Finite element analysis of arbitrarily complex electronics devices

    Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. p. 497-500

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  15. Published

    Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads

    Fellner, K., Antretter, T., Fuchs, P. F. & Tao, Q., 2016, In: Microelectronics Reliability. p. 148-155

    Research output: Contribution to journal › Article › Research › peer-review

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