Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads
Research output: Contribution to journal › Article › Research › peer-review
Authors
Organisational units
External Organisational units
- AT and S AG
Details
| Original language | English |
|---|---|
| Pages (from-to) | 148-155 |
| Journal | Microelectronics Reliability |
| Publication status | Published - 2016 |
