Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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| Translated title of the contribution | Simulation of the 'Single Via Thermal Cycle Test' – Finite Element Modelling of PCBs under thermal loads |
|---|---|
| Original language | English |
| Title of host publication | 13th Youth Symposium on Experimental Solid Mechanics |
| Pages | 29-32 |
| Publication status | Published - 2014 |
