Qi Tao
(Ehemalig)
1 - 8 von 8Seitengröße: 10
Publikationen
- Veröffentlicht
Numerical analysis of the influence of polymeric materials on a MEMS package performance under humidity and temperature loads
Yalagach, M., Filipp Fuchs, P., Wolfberger, A., Gschwandl, M., Antretter, T., Feuchter, M., Tak, C. & Tao, Q., 1 Mai 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers, S. 2029-2035 7 S. 8811123. (2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Elektronische Veröffentlichung vor Drucklegung.
Influence of cooling rate and annealing on the DSC Tg of an epoxy resin
Tao, Q., Pinter, G. & Krivec, T., 27 Juli 2017, (Elektronische Veröffentlichung vor Drucklegung.) in: Microelectronics Reliability. 78.2017, November, S. 396-400 5 S.Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Press Cycle Time Reduction of A Reinforced Epoxy Resin and the Influence On Its Mechanical/Thermal Properties
Tao, Q., 2018Publikationen: Thesis / Studienabschlussarbeiten und Habilitationsschriften › Dissertation
- Veröffentlicht
Model Free Kinetics coupled with Finite Element Method for curing simulation of thermosetting epoxy resins
Tao, Q., Pinter, G. G., Antretter, T., Krivec, T. & Fuchs, P., 2018, in: Journal of Applied Polymer Science. S. 1-8Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)
- Veröffentlicht
Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics
Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Characterization and modeling of a typical curing material for photoresist films
Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics
Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
- Veröffentlicht
Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics
Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband
