Peter Fuchs

(Ehemalig)

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Publikationen

  1. 2024
  2. Veröffentlicht

    A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

    Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  3. Veröffentlicht

    Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

    Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  4. 2023
  5. Veröffentlicht

    Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

    Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  6. 2022
  7. Veröffentlicht

    A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

    Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  8. Veröffentlicht

    Characterization and modeling of a typical curing material for photoresist films

    Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  9. 2021
  10. Veröffentlicht

    Mechanical behavior of 3D-printed polymeric metamaterials for lightweight applications

    Truszkiewicz, E., Thalhamer, A., Rossegger, M., Vetter, M., Meier, G., Rossegger, E., Fuchs, P., Schlögl, S. & Berer, M., 1 Nov. 2021, in: Journal of applied polymer science. 139, 6, 51618.

    Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

  11. Veröffentlicht

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  12. Veröffentlicht

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr. 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  13. Veröffentlicht

    Quantifying matrix-fiber mechanical interactions in hyperelastic materials

    Mansouri, M. R., Beter, J., Fuchs, P. F., Schrittesser, B. & Pinter, G., 5 Jan. 2021, in: International Journal of Mechanical Sciences. 195.2021, 1 April, 14 S., 106268.

    Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

  14. Veröffentlicht

    Process simulation for digital light processing (DLP) based 3D printing

    Thalhammer, A., Strohmeier, L., Pishvazadeh Moghaddam, H., Wolfberger, A. & Fuchs, P., 2021.

    Publikationen: Konferenzbeitrag › Poster › Forschung

  15. 2020
  16. Veröffentlicht

    Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

    Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dez. 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, S. 380-385 6 S. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  17. Veröffentlicht

    The Tension-Twist Coupling Mechanism in Flexible Composites: A Systematic Study Based on Tailored Laminate Structures Using a Novel Test Device

    Beter, J., Schrittesser, B., Meier, G., Lechner, B., Mansouri, M., Fuchs, P. F. & Pinter, G., 24 Nov. 2020, in: Polymers. 12.2020, 12, S. 1-16 16 S., 2780.

    Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

  18. Veröffentlicht

    Viscoelastic Behavior of Glass-Fiber-Reinforced Silicone Composites Exposed to Cyclic Loading

    Beter, J., Schrittesser, B., Lechner, B., Mansouri, M. R., Marano, C., Fuchs, P. F. & Pinter, G., 19 Aug. 2020, in: Polymers. 12.2020, 9, 17 S., 1862.

    Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

  19. Veröffentlicht

    Influence of Fiber Orientation and Adhesion Properties On Tailored Fiber-reinforced Elastomers

    Beter, J., Schrittesser, B., Meier, G., Fuchs, P. F. & Pinter, G., 4 Mai 2020, in: Applied composite materials. 27.2020, 3, S. 149-164 16 S.

    Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

  20. Veröffentlicht

    Comparison and Impact of Different Fiber Debond Techniques on Fiber Reinforced Flexible Composites

    Beter, J., Schrittesser, B., Maroh, B., Sarlin, E., Fuchs, P. F. & Pinter, G., 18 Feb. 2020, in: Polymers. 12.2020, 2, 11 S., 472.

    Publikationen: Beitrag in Fachzeitschrift › Artikel › Forschung › (peer-reviewed)

  21. 2018
  22. Veröffentlicht

    Influence of environmental factors like temperature and humidity on MEMS packaging materials.

    Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov. 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  23. Veröffentlicht

    Gradient polymer composites for optimum heat dissipation

    Marx, P., Morak, M., Gschwandl, M., Fuchs, P., Antretter, T., Pfost, M., Kern, W. & Wiesbrock, F., 2018, in: Journal of the American Chemical Society. 2, 1 S., PMSE-772.

    Publikationen: Beitrag in Fachzeitschrift › Meeting Abstract

  24. 2016
  25. Veröffentlicht

    Finite element analysis of arbitrarily complex electronics devices

    Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. S. 497-500

    Publikationen: Beitrag in Buch/Bericht/Konferenzband › Beitrag in Konferenzband

  26. 2012
  27. Veröffentlicht

    REDUKTION DER NICHTKONFORMITÄTSKOSTEN IM PROFITCENTER GIESSEREI DER MFL DURCH PRÄVENTIVE QUALITÄTSMANAGEMENT-INSTRUMENTE

    Fuchs, P., 2012

    Publikationen: Thesis / Studienabschlussarbeiten und Habilitationsschriften › Master Thesis (Universitätslehrgang)

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