Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

Publikationen: Beitrag in Buch/Bericht/KonferenzbandBeitrag in Konferenzband

Autoren

  • A. Thalhamer
  • S. Hasil
  • K. Hrbinic
  • V. Feigl
  • M. Pfost

Externe Organisationseinheiten

  • Polymer Competence Center Leoben GmbH
  • Chair of Energy Conversion
  • Technische Universität Dortmund

Details

OriginalspracheEnglisch
Titel2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Herausgeber (Verlag)Institute of Electrical and Electronics Engineers
ISBN (elektronisch)9798350345971
DOIs
StatusVeröffentlicht - 2023
Veranstaltung24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023 - Graz, Österreich
Dauer: 16 Apr. 202319 Apr. 2023

Publikationsreihe

Name2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023

Konferenz

Konferenz24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023
Land/GebietÖsterreich
OrtGraz
Zeitraum16/04/2319/04/23