Research output

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  1. 2014
  2. Published

    Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

    Macurova, K., Bermejo Moratinos, R., Pletz, M., Schöngrundner, R., Antretter, T., Krivec, T., Morianz, M., Brizoux, M. & Lecavelier, A., 1 Jan 2014, Proceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014. p. 355-360 6 p.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Aktuelle Aktivitäten zu den Europäischen Rohstoffinitiativen

    Maier, A., Moser, P., Eichlseder, W., Mühlburger, M., Brugger, K., Antrekowitsch, H. & Hoscher, M., 2014, In: Berg- und hüttenmännische Monatshefte : BHM. p. 143-148

    Research output: Contribution to journal › Article › Research › peer-review

  4. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Pélisset, T., Karunamurthy, B., Otremba, R. & Antretter, T., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  5. Published

    Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

    Antretter, T., Otremba, R., Karunamurthy, B. & Pélisset, T., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014.

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. Published

    Critical assessment of the determination of residual stress profiles in thin films by means of the ion beam layer removal method

    Schöngrundner, R., Treml, R., Antretter, T., Kozic, D., Ecker, W. & Kiener, D., 2014, In: Thin solid films. p. 321-330

    Research output: Contribution to journal › Article › Research › peer-review

  7. Published

    Determination of cyclic mechanical properties of thin copper layers for PCB applications

    Fellner, K., Fuchs, P. F., Antretter, T., Pinter, G. & Schöngrundner, R., 2014, Proceedings 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. p. 1-8

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Evaluation of the residual stress distribution in thin films by means of the ion beam layer removal method

    Kozic, D., Treml, R., Schöngrundner, R., Brunner, R., Kiener, D., Antretter, T. & Gänser, H-P., 2014, Proceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014. Zhang, G. Q., Van Driel, W. D., Rodgers, P., Bailey, C. & de Saint Leger, O. (eds.). Institute of Electrical and Electronics Engineers, 6813785

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. Published

    Festigkeitsskalierung nach Weibull

    Pittino, G., Tichy, R., Galler, R., Antretter, T., Ecker, W., Gimpel, M. & Kargl, H., 2014.

    Research output: Contribution to conference › Poster › Research › peer-review

  10. Published

    Method development for the cyclic characterization of thin copper layers for PCB applications

    Fellner, K., Fuchs, P. F., Pinter, G., Antretter, T. & Krivec, T., 2014, In: Circuit World. 40, p. 53-60

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Microwave absorption and its thermo-mechanical consequences in heterogeneous rocks

    Toifl, M., Meisels, R., Hartlieb, P., Kuchar, F. & Antretter, T., 2014, Geomechanics from Micro to Macro. p. 1545-1550

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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