Peter Fuchs

(Former)

1 - 19 out of 19Page size: 50

Research output

  1. 2024
  2. Published

    A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

    Kamble, V. G., Patel, D. R., Schipfer, C., Thalhamer, A., Zuendel, J., Krivec, T., Antretter, T. & Fuchs, P. F., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  3. Published

    Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics

    Peng, C., Tao, Q., Krivec, T., Casas, G., Latorre, S., Antretter, T., Macher, J. & Fuchs, P., 2024, 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Institute of Electrical and Electronics Engineers, (2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  4. 2023
  5. Published

    Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts

    Thalhamer, A., Rossegger, E., Hasil, S., Hrbinic, K., Feigl, V., Pfost, M. & Fuchs, P., 2023, 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023. Institute of Electrical and Electronics Engineers, (2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2023).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  6. 2022
  7. Published

    A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process

    Thalhamer, A., Fuchs, P., Strohmeier, L., Hasil, S. & Wolfberger, A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  8. Published

    Characterization and modeling of a typical curing material for photoresist films

    Peng, C., Morak, M., Thalhamer, A., Gschwandl, M., Fuchs, P., Tao, Q., Krivec, T., Antretter, T. & Celigueta, M. A., 2022, 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers, (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  9. 2021
  10. Published

    Mechanical behavior of 3D-printed polymeric metamaterials for lightweight applications

    Truszkiewicz, E., Thalhamer, A., Rossegger, M., Vetter, M., Meier, G., Rossegger, E., Fuchs, P., Schlögl, S. & Berer, M., 1 Nov 2021, In: Journal of applied polymer science. 139, 6, 51618.

    Research output: Contribution to journal › Article › Research › peer-review

  11. Published

    Electro-Thermo-Mechanical Reliability Assessment of Arbitrary Power Electronics

    Gschwandl, M., Pfost, M., Antretter, T., Fuchs, P. F., Mitev, I., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410862. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  12. Published

    Prediction of Curing Induced Residual Stresses in Polymeric Encapsulation Materials for Microelectronics

    Schipfer, C., Gschwandl, M., Fuchs, P., Antretter, T., Feuchter, M., Morak, M., Tao, Q. & Schingale, A., 19 Apr 2021, 2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers, 9410855. (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  13. Published

    Quantifying matrix-fiber mechanical interactions in hyperelastic materials

    Mansouri, M. R., Beter, J., Fuchs, P. F., Schrittesser, B. & Pinter, G., 5 Jan 2021, In: International Journal of Mechanical Sciences. 195.2021, 1 April, 14 p., 106268.

    Research output: Contribution to journal › Article › Research › peer-review

  14. Published

    Process simulation for digital light processing (DLP) based 3D printing

    Thalhammer, A., Strohmeier, L., Pishvazadeh Moghaddam, H., Wolfberger, A. & Fuchs, P., 2021.

    Research output: Contribution to conference › Poster › Research

  15. 2020
  16. Published

    Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions

    Yalagach, M., Fuchs, P. F., Antretter, T., Qi, T. & Weber, M., 2 Dec 2020, 2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020. Institute of Electrical and Electronics Engineers, p. 380-385 6 p. 9315091. (2020 IEEE 22nd Electronics Packaging Technology Conference, EPTC 2020).

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  17. Published

    The Tension-Twist Coupling Mechanism in Flexible Composites: A Systematic Study Based on Tailored Laminate Structures Using a Novel Test Device

    Beter, J., Schrittesser, B., Meier, G., Lechner, B., Mansouri, M., Fuchs, P. F. & Pinter, G., 24 Nov 2020, In: Polymers. 12.2020, 12, p. 1-16 16 p., 2780.

    Research output: Contribution to journal › Article › Research › peer-review

  18. Published

    Viscoelastic Behavior of Glass-Fiber-Reinforced Silicone Composites Exposed to Cyclic Loading

    Beter, J., Schrittesser, B., Lechner, B., Mansouri, M. R., Marano, C., Fuchs, P. F. & Pinter, G., 19 Aug 2020, In: Polymers. 12.2020, 9, 17 p., 1862.

    Research output: Contribution to journal › Article › Research › peer-review

  19. Published

    Influence of Fiber Orientation and Adhesion Properties On Tailored Fiber-reinforced Elastomers

    Beter, J., Schrittesser, B., Meier, G., Fuchs, P. F. & Pinter, G., 4 May 2020, In: Applied composite materials. 27.2020, 3, p. 149-164 16 p.

    Research output: Contribution to journal › Article › Research › peer-review

  20. Published

    Comparison and Impact of Different Fiber Debond Techniques on Fiber Reinforced Flexible Composites

    Beter, J., Schrittesser, B., Maroh, B., Sarlin, E., Fuchs, P. F. & Pinter, G., 18 Feb 2020, In: Polymers. 12.2020, 2, 11 p., 472.

    Research output: Contribution to journal › Article › Research › peer-review

  21. 2018
  22. Published

    Influence of environmental factors like temperature and humidity on MEMS packaging materials.

    Yalagach, M., Fuchs, P. F., Mitev, I., Antretter, T., Feuchter, M., Wolfberger, A. & Qi, T., 26 Nov 2018, 2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings. Institute of Electrical and Electronics Engineers, 8546484

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  23. Published

    Gradient polymer composites for optimum heat dissipation

    Marx, P., Morak, M., Gschwandl, M., Fuchs, P., Antretter, T., Pfost, M., Kern, W. & Wiesbrock, F., 2018, In: Journal of the American Chemical Society. 2, 1 p., PMSE-772.

    Research output: Contribution to journal › Meeting Abstract

  24. 2016
  25. Published

    Finite element analysis of arbitrarily complex electronics devices

    Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T. & Tao, Q., 2016, Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016. p. 497-500

    Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

  26. 2012
  27. Published

    REDUKTION DER NICHTKONFORMITÄTSKOSTEN IM PROFITCENTER GIESSEREI DER MFL DURCH PRÄVENTIVE QUALITÄTSMANAGEMENT-INSTRUMENTE

    Fuchs, P., 2012

    Research output: Thesis › Master's Thesis (University Course)

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